- bumpless build-up layer packaging
- микр. компоновка слоёв без создания контактных площадок, технология BBULP
The New English-Russian Dictionary of Radio-electronics. F.V Lisovsky . 2005.
bumpless build-up layer packaging
Смотреть что такое "bumpless build-up layer packaging" в других словарях:
Bumpless Build-up Layer — or BBUL is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires. It has build up layers, because is grown / built up… … Wikipedia
